HD580Max ESC HC302B ESC P2 PCBA

Product name:	ESC main board _HC302B_ESC_P2_PCBA
Part number:	135-000696
Project name:	5150

Date: 2025/06/03

Station Number	Workstation	Operation Description	Process Serial Number	Production Equipment/Tools	Number	Unit Price of Fixture	Production Beat
100	Incoming inspection IQC	Inspection of incoming electronic components	1	LCR measuring equipment	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
200	B-side solder paste printing	The solder paste is printed onto the PCB through a steel mesh and printing press	2	Steel mesh/solder paste printing machine/support base	1	SMD factory self-provided Steel mesh/support base, patch factory according to Gerber's own procurement	The patch factory evaluates based on its own equipment and wire configuration
300	Side B SPI inspection	Inspection of the printing quality of solder paste Automatic inspection of solder paste offset DX, DY, solder paste volume, area, height is required	3	SPI equipment (3D best)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
400	B surface patch	Attach electronic components to the PCB printed with solder paste	4	Mounter (CMK greater than 2.0)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
500	B-side solder paste reflux	Electronic components are soldered on the PCB by high-temperature reflow soldering The furnace temperature needs to be monitored Control the Reflow Profile according to the Paste Spec.	5	Reflux furnace (preferably with N2 function)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
600	B side AOI	Inspection of welding quality Inspection standard IPC-610 class3	6	Automatic optical inspection equipment (3D best)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
700	T-side solder paste printing	The solder paste is printed onto the PCB through a steel mesh and printing press	7	Steel mesh/solder paste printing machine/support base	1	SMD factory self-provided Steel mesh/support base, patch factory according to Gerber's own procurement	The patch factory evaluates based on its own equipment and wire configuration
800	T-surface SPI inspection	Inspection of the printing quality of solder paste It is necessary to check the offset DX, DY, volume, area, and height of the solder paste	8	SPI equipment (3D best)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
900	T surface patch	Attach electronic components to the PCB printed with solder paste	9	Mounter (CMK greater than 2.0)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
1000	T-side solder paste reflux	Electronic components are soldered on the PCB by high-temperature reflow soldering The furnace temperature needs to be monitored Control the Reflow Profile according to the Paste Spec.	10	Reflux furnace (preferably with N2 function)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
1100	T-side AOI	Inspection of welding quality Inspection standard IPC-610 class3	11	Automatic optical inspection equipment (3D best)	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
1200	Wave soldering	Soldering of hand-inserted components	12	Wave soldering furnace/wave soldering vehicle	1	SMD factory self-provided Wave soldering vehicle patch factory purchases according to GERBER	The patch factory evaluates based on its own equipment and wire configuration
1300	Split board	Convert panel PCBA to single PCS	13	Automatic splitting machine (milling cutter method)/splitting fixture	1	SMD factory self-provided	The patch factory evaluates based on its own equipment and wire configuration
1400	Assembly	Welding temperature measurement line (hand welding)	14	Soldering iron/assembly fixture	1	XAG provides work instructions SMD factory self-provided The loading plate placement factory purchases according to the gerber and equipment itself	60S/pcs
1500	MCU burning	Burning low-level driver software	15	Burning fixture	1	Fixture/software provided by XAG	15S/pcs
1600	Single board test	Functional testing	16	Test fixture	1	Fixture/software provided by XAG Special requirements: The chip factory needs to configure a large power supply and load You can rent it for an estimated 6000RMB/month.	60s/pcs
1700	Apply three-proof paint	Apply three-proof paint in the designated area as required	17	Three-proof equipment/painting tray	1	SMD factory self-provided The loading plate placement factory purchases according to the gerber and equipment itself	The patch factory evaluates based on its own equipment and wire configuration XAG provides relevant information
1800	Point glue	Reinforcing plug-in element	18	Dispensing machine & dispensing carrier board	1	XAG provides work instructions	The patch factory evaluates based on its own equipment and wire configuration XAG provides relevant information
1900	Inspection QOC	Inspection shipment	19	NA	1	NA	The patch factory evaluates based on its own equipment and wire configuration XAG provides relevant information

Patch requirements: 1. PTH component through hole tin rate > 90%, no bridge at the bottom of the part, no floating part, tilt 2. J1, J3, J4, J5, J8 structural parts need to be tin-filled and can use SMT process Capacitor plates are not allowed to float or tilt. After welding, black glue needs to be inserted between the capacitor on the capacitor plate and the ESC plate. Please refer to the ""HC302B ESC dispensing diagram"" for details. 3. The height of the PTH part pin exposed to the board surface is 0.5~ 1.5mm. If it exceeds 1.5mm, it needs to be trimmed 4. All I-shaped TP points need to be expanded with steel mesh to cover the screen printing frame area with a full amount of tin 5. Sub-board point, the distance between the protruding board edge is required to be ≤ 0.1mm.

Manual Soldering Specifications

Step 1

Solder the two ends of the temperature sensor wire to the corresponding PCBA solder pads (TP17 & TP18).

Attach the other end to the left pin position of the IOS (Q11).

First cover it with UV curing adhesive, then apply UV curing agent.

Use tools & fixtures

1. Electric soldering iron

2. Temperature meter

3. Hot air gun

4. Lead-free solder wire

Operational special requirements

Soldering conditions:

Temperature: 350 °C ±10 °C
Soldering time: 1–3 seconds
Ensure full solder joints with no cold solder, false solder, or solder bridges.

The wire end at IOS must be tightly attached to the space position.

Coating Specifications

Instructions

Areas inside the red boxes are coating areas.
Areas inside the black boxes are prohibited coating areas (screws & connectors).
Priority: ensure prohibited areas are completely avoided.

Adhesive Application

Instructions

Apply adhesive within the red-bordered areas. The adhesive must cover:

The connection between the component leads and the component body.
The area between the component body and the PCB.
The area between the component leads and the PCB. Warning: Adhesive must not overflow past the edge of the board or cover any mounting screw holes.